High temperature electronics application in well logging
نویسندگان
چکیده
منابع مشابه
High Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
متن کاملHigh Temperature Power Electronics – Application Issues of SiC devices
High temperature operation capability of power devices enhances performance of the system especially in the automotive industry where weight and volume are critical factors. SiC devices are capable of operating at higher voltages, higher frequencies, and higher junction temperatures, which result in significant reduction in weight and size of the power converter and an increase in efficiency. I...
متن کاملApplication of the Spread - Spectrum Technique in Well Logging
This paper presents the novel concept of employing the noise insensitive spread-spectrum technique in well logging. The proposed design of a spread-spectrum device improves the performance of well logging tools, particularly within highly noisy environments. The heart of the device is a shift register which generates a pseudorandom binary code sequence. A coder is connected to the transmitter a...
متن کاملConsiderations of Well Cementing Materials in High-Pressure, High-Temperature Conditions (RESEARCH NOTE)
As worldwide demand of hydrocarbon is growing fast, the oil and gas companies have been forced to explore reservoirs with more hostile conditions, such as high-pressure, high-temperature conditions. Improved technology, material selection and testing procedures are required to overcome the common problems in these conditions. One of the main phases of well construction is cementing job. Appropr...
متن کاملDie Attach for High Temperature Electronics Packaging
AuSi, patterned Au and off-eutectic Sn-Au-Sn die attach materials and processes have been investigated for SiC die attach for high temperature applications. AuSi shear test results after 3000 hours of aging at 325C in air showed only a slight decrease in shear strength when assembled on Mo:Mn/Pd/Au metallized AlN. However, when assembled on Mo:Mn/Ni/Au metallized AlN, the die shear strength dec...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEE Transactions on Nuclear Science
سال: 1988
ISSN: 0018-9499,1558-1578
DOI: 10.1109/23.12845